Oscillator, electronic apparatus, and vehicle

ABSTRACT

An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

This application claims the benefit of priority from Japanese PatentApplication No. 2017-226674 filed Nov. 27, 2017, and Japanese PatentApplication No. 2018-118664 filed Jun. 22, 2018, the entire contents ofthe prior applications being incorporated herein by reference.

BACKGROUND 1. Technical Field

The present invention relates to an oscillator, an electronic apparatus,and a vehicle.

2. Related Art

Oscillators that oscillate resonators such as quartz crystal resonatorsand output signals having desired frequencies have been widely used invarious electronic apparatuses and systems. In order to meet requestsfor miniaturization, an oscillator in which a resonator and anintegrated circuit (IC) for oscillating the resonator are stacked isknown. For example, JP-A-2010-10480 discloses a semiconductor module inwhich a quartz crystal resonator and a semiconductor element are stackedon a substrate. In this semiconductor module, an electronic componentsuch as an inductor is mounted on a substrate as a body separate fromthe quartz crystal resonator and the semiconductor element.

However, in an oscillator in which a resonator and an IC are stacked,the inventor of this application has found that a new problem occurs ina case where a configuration in which an inductor is built into the ICis adopted for further miniaturization. That is, a magnetic fieldgenerated due to a current flowing into the inductor is blocked by ametal member constituting a portion of a quartz crystal resonator, andan eddy current is generated inside the metal member. As a result, ithas been found that there is a concern that a Q value of the inductor isdeteriorated and a function as a circuit element is deteriorated.

SUMMARY

An advantage of some aspects of the invention is to provide anoscillator capable of reducing a concern that a Q value of an inductorbuilt into an integrated circuit element is deteriorated. In addition,an advantage of some aspects of the invention is also to provide anelectronic apparatus and a vehicle which use the oscillator.

The invention can be implemented as the following forms or applicationexamples.

Application Example 1

An oscillator according to this application example includes a resonatorwhich includes a resonator element and a resonator element containeraccommodating the resonator element, and an integrated circuit elementwhich includes an inductor, in which the resonator and the integratedcircuit element are stacked on each other, the resonator includes ametal member, and the metal member does not overlap the inductor whenviewed in a plan view.

In the oscillator according to this application example, the metalmember included in the resonator does not overlap the inductor includedin the integrated circuit element when viewed in a plan view, and thus amagnetic field generated due to a current flowing into the inductor ishardly blocked by the metal member included in the resonator, and aneddy current is hardly generated inside the metal member. Therefore,according to the oscillator of the application example, thedeterioration of a Q value of the inductor is reduced, and a concernthat a function as a circuit element is deteriorated is reduced.

Application Example 2

In the oscillator according to the application example, the integratedcircuit element may further include a guard ring provided in a vicinityof the inductor, and the metal member may not overlap the guard ringwhen viewed in a plan view.

In the oscillator according to this application example, the metalmember included in the resonator does not overlap the guard ringprovided in the vicinity of the inductor when viewed in a plan view, andthus a distance between the metal member included in the resonator andthe inductor is relatively large. Therefore, according to the oscillatorof the application example, a magnetic field generated due to a currentflowing into the inductor is hardly blocked by the metal member includedin the resonator, and an eddy current is hardly generated inside themetal member. Therefore, the deterioration of a Q value of the inductoris reduced, and a concern that a function as a circuit element isdeteriorated is reduced.

Application Example 3

In the oscillator according to the application example, the integratedcircuit element may include a PLL circuit including the inductor and afilter, and the filter may overlap the metal member when viewed in aplan view.

In the oscillator according to this application example, the filterhardly influenced by the metal member included in the resonator isdisposed so as to overlap the resonator when viewed in a plan view, andthus a region overlapping the resonator is also effectively used.Therefore, according to the application example, an increase in the sizeof the area of the integrated circuit element is reduced, and theminiaturization of the oscillator is realized. Meanwhile, in theoscillator according to the application example, the entirety of thefilter does not necessarily need to overlap the metal member, and aportion of the filter may overlap the metal member.

Application Example 4

In the oscillator according to the application example, the integratedcircuit element may include an oscillation circuit which is connected tothe resonator, and an output circuit which outputs a signal based on anoscillation signal output from the PLL circuit, the oscillation signalmay be phase-synchronized with an output signal of the oscillationcircuit, and the PLL circuit may be disposed between the oscillationcircuit and the output circuit when viewed in a plan view.

In the oscillator according to this application example, the outputsignal of the oscillation circuit propagates to the PLL circuit, and anoscillation signal output from the PLL circuit propagates to the outputcircuit. Accordingly, the PLL circuit is disposed between theoscillation circuit and the output circuit so as to be matched to flowsof various signals, and thus wirings through which the various signalspropagate are shortened. Therefore, according to the oscillator of theapplication example, parasitic capacitance of each wiring is reduced,and noise superimposed on each signal due to crosstalk with othersignals or the like is reduced.

Application Example 5

In the oscillator according to the application example, the integratedcircuit element may include a first pad which is electrically connectedto one end of the resonator, a second pad which is electricallyconnected to the other end of the resonator, and a third pad which iselectrically connected to the output circuit, the first pad and thesecond pad may be provided along a first side of the integrated circuitelement, and the third pad may be provided along a second side facingthe first side of the integrated circuit element.

In the oscillator according to this application example, a signal inputto the integrated circuit element through the first pad or the secondpad provided along the first side from the resonator propagates towardthe second side from the first side, and is output through the third padprovided along the second side. For this reason, in the integratedcircuit element, it is easy to dispose the circuits so that varioussignals flow in substantially one direction toward the second side fromthe first side, and various wirings through which the various signalspropagate are shortened. Therefore, according to the oscillator of theapplication example, parasitic capacitance of each wiring is reduced,and noise superimposed on each signal due to crosstalk with othersignals or the like is reduced.

Application Example 6

In the oscillator according to the application example, the resonatorelement container may include a base which is provided with a concaveportion accommodating the resonator element, and a lid which is themetal member, and the resonator may be mounted on the integrated circuitelement so that the lid faces the integrated circuit element.

In the oscillator according to this application example, the lid of theresonator element container does not overlap the inductor when viewed ina plan view, and thus a magnetic field generated due to a currentflowing into the inductor is hardly blocked by the lid which is a metalmember, and an eddy current is hardly generated inside the lid.Therefore, according to the oscillator of the application example, thedeterioration of a Q value of the inductor is reduced, and a concernthat a function as a circuit element is deteriorated is reduced.

In addition, according to the oscillator of this application example, itis possible to connect the electrode provided on the outer surface ofthe base of the resonator element container and the electrode providedin the integrated circuit element by wire bonding, and thus it is easyto mount the oscillator.

Application Example 7

In the oscillator according to the application example, the metal membermay be an electrode provided in the resonator element.

In the oscillator according to this application example, the electrodeprovided in the resonator element does not overlap the inductor whenviewed in a plan view, and thus a magnetic field generated due to acurrent flowing into the inductor is hardly blocked by the electrodeprovided in the resonator element, and an eddy current is hardlygenerated inside the electrode. Therefore, according to the oscillatorof the application example, the deterioration of a Q value of theinductor is reduced, and a concern that a function as a circuit elementis deteriorated is reduced.

Application Example 8

In the oscillator according to the application example, a firstelectrode, a second electrode, a third electrode, and a fourth electrodemay be provided at four corners on an outer surface of the resonatorelement container, the first electrode and the third electrode may beprovided at two corners on a diagonal of the outer surface, the secondelectrode and the fourth electrode may be provided at the other twocorners on a diagonal of the outer surface, and the third electrode mayextend between the first electrode and the second electrode.

In the oscillator according to this application example, the thirdelectrode extends between the first electrode and the second electrodeon the outer surface of the resonator element container, and thus twobonding wires connecting two terminals for connecting the firstelectrode and the third electrode and the resonator provided at apredetermined side of the integrated circuit element are shortened,thereby lowering the wires. Therefore, according to the oscillator ofthe application example, a concern that some of the wires are exposed tothe outside of the mold resin is reduced in a sealing process of theresonator and the integrated circuit element.

Meanwhile, many types of resonators are configured such that terminalsare provided at four corners and have similar appearances in order tomeet demands for compatibility. Accordingly, in a case where differenttypes of resonators are mixed in a resonator group to be manufactured ina manufacturing process, it is difficult to distinguish between theresonators by their appearances, and a situation where distinction isfirst made in an inspection process may occur. On the other hand, in theoscillator according to this application example, demands forcompatibility are met because the four electrodes are provided at fourcorners on the outer surface of the resonator element container, and itis possible to distinguish the resonator from other resonators byappearance because the third electrode has a characteristic shapegreatly different from those of other types of resonators.

Application Example 9

An oscillator according to this application example includes a resonatorwhich includes a resonator element and a resonator element containeraccommodating the resonator element, and an integrated circuit element,in which the resonator and the integrated circuit element may be stackedon each other, the integrated circuit element may include an oscillationcircuit which is connected to the resonator, a first PLL circuit whichincludes a first inductor, and a second PLL circuit which includes asecond inductor, a first oscillation signal output from the first PLLcircuit and a second oscillation signal output from the second PLLcircuit may be phase-synchronized with an output signal of theoscillation circuit, the resonator may include a metal member, and themetal member may not overlap the first inductor and the second inductorwhen viewed in a plan view.

In the oscillator according to this application example, the metalmember included in the resonator does not overlap the first inductorincluded in the first PLL circuit and the second inductor included inthe second PLL circuit when viewed in a plan view, and thus a magneticfield generated due to a current flowing into the first inductor and amagnetic field generated due to a current flowing into the secondinductor are hardly blocked by the metal member included in theresonator, and an eddy current is hardly generated inside the metalmember. Therefore, according to the oscillator of the applicationexample, the deterioration of Q values of the first inductor and thesecond inductor is reduced, and a concern that a function as a circuitelement is deteriorated is reduced.

Application Example 10

An electronic apparatus according to this application example includesany one of the above-described oscillators.

Application Example 11

A vehicle according to this application example includes any one of theabove-described oscillators.

According to these application examples, it is possible to implement theelectronic apparatus and the vehicle including the oscillator which iscapable of reducing a concern that a Q value of the inductor built intothe integrated circuit element is deteriorated and having higherreliability.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a functional block diagram of an oscillator of this exemplaryembodiment.

FIG. 2 is a diagram illustrating a configuration example of voltagecontrolled oscillators.

FIG. 3 is a perspective view of the oscillator of this exemplaryembodiment.

FIG. 4 is a side view of the oscillator of this exemplary embodiment.

FIG. 5 is a plan view when the oscillator of this exemplary embodimentis viewed from above.

FIG. 6 is a diagram illustrating an example of the internal arrangementof an integrated circuit element.

FIG. 7 is a functional block diagram of an electronic apparatus of thisexemplary embodiment.

FIG. 8 is a diagram illustrating an example of the appearance of theelectronic apparatus of this exemplary embodiment.

FIG. 9 is a diagram illustrating an example of a vehicle of thisexemplary embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, a preferred exemplary embodiment of the invention will bedescribed in detail with reference to the accompanying drawings.Meanwhile, the exemplary embodiment to be described below does notunduly limit the contents of the invention described in the appendedclaims. In addition, all configurations to be described below are notlimited to being essential constituent conditions of the invention.

1. Oscillator

1-1. Functional Configuration of Oscillator

FIG. 1 is a functional block diagram of an oscillator 1 of thisexemplary embodiment. As illustrated in FIG. 1, the oscillator 1 of thisexemplary embodiment is configured to include an integrated circuitelement 10 and a resonator 20.

As the resonator 20, for example, a quartz crystal resonator, a SurfaceAcoustic Wave (SAW) resonant element, other piezoelectric resonantelements, a Micro Electro Mechanical Systems (MEMS) resonator, and thelike can be used.

In this exemplary embodiment, the integrated circuit element 10 isconfigured as an integrated circuit (IC) of one chip, and includes anoscillation circuit 11 (OSC), a control circuit 12 (Control Logic), avoltage regulator 13 (VREG), two PLL circuits 14 and 15, and four outputcircuits 16, 17, 18, and 19. Meanwhile, the integrated circuit element10 may be configured such that some of these components are omitted orchanged, or other components are added.

The voltage regulator 13 generates a predetermined voltage with a groundvoltage (0 V) supplied through a VSS terminal as a reference, on thebasis of a power voltage supplied through a VDD terminal. The voltagegenerated by the voltage regulator 13 serves as power voltages of theoscillation circuit 11 and the two PLL circuits 14 and 15.

The oscillation circuit 11 is connected to one end (an electrode 26 a(see FIG. 5)) of the resonator 20 through an XG terminal and isconnected to the other end (an electrode 26 c (see FIG. 5)) of theresonator 20 through an XD terminal. The oscillation circuit 11oscillates the resonator 20 by amplifying an output signal of theresonator 20 which is input through the XG terminal and feeding back theamplified signal to the resonator 20 through the XD terminal. Forexample, the oscillation circuit constituted by the resonator 20 and theoscillation circuit 11 may be any of various types of oscillationcircuits such as a pierced oscillation circuit, an inverter-typeoscillation circuit, a Colpitts oscillation circuit, and a Hartleyoscillation circuit.

The PLL circuit 14 (an example of “a first PLL circuit”) isphase-synchronized with an oscillation signal output from theoscillation circuit 11, generates an oscillation signal (an example of“a first oscillation signal”) obtained by multiplying and dividing thefrequency of the oscillation signal, and outputs the generatedoscillation signal. Similarly, the PLL circuit 15 (an example of “asecond PLL circuit”) is phase-synchronized with an oscillation signaloutput from the oscillation circuit 11, generates an oscillation signal(an example of “a second oscillation signal”) obtained by multiplyingand dividing the frequency of the oscillation signal, and outputs thegenerated oscillation signal. The number of times of multiplication anda frequency division ratio of the PLL circuit 14 are set in accordancewith a control signal PLLCTRL1, and the number of times ofmultiplication and a frequency division ratio of the PLL circuit 15 areset in accordance with a control signal PLLCTRL2.

In this exemplary embodiment, the two PLL circuits 14 and 15 arefractional N-PLL circuits. Specifically, the PLL circuit 14 isconfigured to include a phase comparator 141 (PFD), a charge pump 142(CP), a low-pass filter 143 (LPF), a voltage controlled oscillator 144(VCO), a frequency division circuit 145 (FDIV1), and a frequencydivision circuit 146 (ODIV1).

The phase comparator 141 compares a phase difference between anoscillation signal output by the oscillation circuit 11 and anoscillation signal output by the frequency division circuit 145, andoutputs a comparison result as a pulse voltage.

The charge pump 142 converts a pulse voltage output by the phasecomparator 141 into a current, and the low-pass filter 143 smoothens thecurrent output by the charge pump 142 and converts the smoothenedcurrent into a voltage.

The voltage controlled oscillator 144 outputs an oscillation signal ofwhich the frequency changes depending on an output voltage of thelow-pass filter 143. In this exemplary embodiment, the voltagecontrolled oscillator 144 is realized by an LC oscillation circuitconstituted using an inductor and a variable capacity element.

The frequency division circuit 145 outputs an oscillation signal,obtained by performing integer frequency division on an oscillationsignal output by the voltage controlled oscillator 144, at a frequencydivision ratio (integer frequency division ratio) which is set inaccordance with the control signal PLLCTRL1. In this exemplaryembodiment, a frequency division ratio (integer frequency divisionratio) of the frequency division circuit 145 changes to a plurality ofinteger values in a range around an integer value N in time series, anda time average value thereof is N+F/M. Therefore, in a normal statewhere the phase of an oscillation signal output from the oscillationcircuit 11 and the phase of an oscillation signal output from thefrequency division circuit 145 are synchronized with each other, afrequency f_(vco) of the oscillation signal output from the voltagecontrolled oscillator 144 and a frequency f_(osc) of the oscillationsignal output from the oscillation circuit 11 satisfy a relationship ofExpression (1).

$\begin{matrix}{f_{VCO} = {\left( {N + \frac{F}{M}} \right) \times f_{OSC}}} & (1)\end{matrix}$

The frequency division circuit 146 outputs an oscillation signal,obtained by performing integer frequency division on the oscillationsignal output by the voltage controlled oscillator 144, at a frequencydivision ratio which is set in accordance with the control signalPLLCTRL1. In this exemplary embodiment, the frequency division circuit146 outputs four types of oscillation signals. Frequencies of these fourtypes of oscillation signals are determined by four types of frequencydivision ratios which are set in accordance with the control signalPLLCTRL1.

Similarly to the PLL circuit 14, the PLL circuit 15 is configured toinclude a phase comparator 151 (PFD), a charge pump 152 (CP), a low-passfilter 153 (LPF), a voltage controlled oscillator 154 (VCO), a frequencydivision circuit 155 (FDIV1), and a frequency division circuit 156(ODIV1). The configuration of the PLL circuit 15 is the same as that ofthe PLL circuit 14, and thus a description thereof will not be repeated.

The four output circuits 16, 17, 18, and 19 output a signal based onoscillation signals output from the two PLL circuits 14 and 15.Specifically, an oscillation signal output from the oscillation circuit11 is input to the four output circuits 16, 17, 18, and 19 in common,and one oscillation signal among the four types of oscillation signalsoutput from the PLL circuit 14 (frequency division circuit 146) and oneoscillation signal among the four types of oscillation signals outputfrom the PLL circuit 15 (frequency division circuit 156) are input tothe four output circuits 16, 17, 18, and 19. The four output circuits16, 17, 18, and 19 generate an oscillation signal obtained by performingfrequency-division on one oscillation signal selected from the inputthree types of oscillation signals, and outputs the generatedoscillation signal in a selected output format. The selection of anoscillation signal and an output format and the setting of a frequencydivision ratio on the output circuits 16, 17, 18, and 19 are performedin accordance with the control signals OUTCTRL1, OUTCTRL2, OUTCTRL3, andOUTCTRL4.

In this exemplary embodiment, the output circuit 16 is configured toinclude a frequency division circuit 161 (ODIV2) and an output buffer162 (OBUF).

The frequency division circuit 161 selects any one of the oscillationsignal output from the oscillation circuit 11, the oscillation signaloutput from the PLL circuit 14 (frequency division circuit 146), and theoscillation signal output from the PLL circuit 15 (frequency divisioncircuit 156) in accordance with the control signal OUTCTRL1, and outputan oscillation signal obtained by performing frequency-division on theselected oscillation signal at a frequency division ratio set inaccordance with the control signal OUTCTRL1.

The output buffer 162 converts the oscillation signal output from thefrequency division circuit 161 into an oscillation signal in an outputformat selected in accordance with the control signal OUTCTRL1, on thebasis of a power voltage supplied through a VDDO1 terminal, and outputsthe converted oscillation signal to the outside (the outside of theoscillator 1) of the integrated circuit element 10 through at least oneof an OUT1 terminal and an OUT1B terminal. For example, the outputbuffer 162 outputs a differential oscillation signal through the OUT1terminal and the OUT1B terminal in a case where a differential outputsuch as a Positive Emitter Coupled Logic (PECL) output, a Low VoltageDifferential Signaling (LVDS) output, or a High-Speed Current SteeringLogic (HCSL) output is selected, and outputs a single-ended oscillationsignal through the OUT1 terminal or the OUT1B terminal in a case where asingle-ended output such as a Complementary Metal Oxide Semiconductor(CMOS) output is selected as an output format. Meanwhile, the output ofan oscillation signal or the stop of output of an oscillation signal bythe output buffer 162 is controlled in accordance with the controlsignal OUTCTRL1.

Similarly to the output circuit 16, the output circuit 17 is configuredto include a frequency division circuit 171 (ODIV2) and an output buffer172 (OBUF), generates an oscillation signal in an output format selectedin accordance with the control signal OUTCTRL2 on the basis of a powervoltage supplied through a VDDO2 terminal, and outputs the generatedoscillation signal to the outside (the outside of the oscillator 1) ofthe integrated circuit element 10 through at least one of the OUT2terminal and the OUT2B terminal. Similarly, the output circuit 18 isconfigured to include a frequency division circuit 181 (ODIV2) and anoutput buffer 182 (OBUF), generates an oscillation signal in an outputformat selected in accordance with the control signal OUTCTRL3 on thebasis of a power voltage supplied through a VDDO3 terminal, and outputsthe generated oscillation signal to the outside (the outside of theoscillator 1) of the integrated circuit element 10 through at least oneof an OUT3 terminal and an OUT3B terminal. Similarly, the output circuit19 is configured to include a frequency division circuit 191 (ODIV2) andan output buffer 192 (OBUF), generates an oscillation signal in anoutput format selected in accordance with a control signal OUTCTRL4 onthe basis of a power voltage supplied through a VDDO4 terminal, andoutputs the generated oscillation signal to the outside (the outside ofthe oscillator 1) of the integrated circuit element 10 through at leastone of the OUT4 terminal and the OUT4B terminal. Configurations of theoutput circuits 17, 18, and 19 are the same as that of the outputcircuit 16, and thus a description thereof will not be repeated.

The control circuit 12 generates the above-described control signalsPLLCTRL1, PLLCTRL2, OUTCTRL1, OUTCTRL2, OUTCTRL3, and OUTCTRL4.Specifically, the control circuit includes an interface circuitcorresponding to an Inter-Integrated Circuit (I²C) bus and a storagecircuit (for example, a register) (both are not shown in the drawing),receives a serial data signal input through a SDA terminal insynchronization with a serial clock signal input through a SCL terminalfrom an external device not shown in the drawing, and stores variouspieces of data in the storage circuit in accordance with the receivedserial data. The control circuit 12 generates each control signal on thebasis of various pieces of data stored in the storage circuit.Meanwhile, the interface circuit included in the control circuit 12 isnot limited to an interface circuit corresponding to an I²C bus, and maybe, for example, an interface circuit corresponding to a SerialPeripheral Interface (SPI) bus.

FIG. 2 is a diagram illustrating a configuration example of the voltagecontrolled oscillators 144 and 154. The voltage controlled oscillators144 and 154 illustrated in FIG. 2 is configured to include a currentsource 31, inductors 32 and 33, variable capacity diodes (varactors) 34and 35 which are variable capacity elements, and N-channel type MOStransistors 36 and 37, and outputs oscillation signals (for example,differential signals OUT+ and OUT−) generated by an oscillation stageconstituted by the N-channel type MOS transistors 36 and 37. An outputvoltage of the low-pass filter 143 or the low-pass filter 153 is appliedto a node N1 to which the anode of the variable capacity diode 34 andthe anode of the variable capacity diode 35 are connected, andcapacitance values of the variable capacity diodes 34 and 35 changedepending on a voltage of the node N1. The frequencies of oscillationsignals output from the voltage controlled oscillators 144 and 154 aredetermined in accordance with inductance values of the inductors 32 and33 and the capacitance values of the variable capacity diodes 34 and 35.

The oscillator 1 according to this exemplary embodiment which isconfigured as described above and usable as a clock signal generationdevice (clock generator) generates oscillation signals having aplurality of types of frequencies according to setting on the basis ofan oscillation signal output from the resonator 20 and outputs thegenerated oscillation signals.

1-2. Structure of Oscillator

FIGS. 3 to 5 are diagrams illustrating an example of the structure ofthe oscillator 1 of this exemplary embodiment. FIG. 3 is a perspectiveview of the oscillator 1, FIG. 4 is a side view of the oscillator 1, andFIG. 5 is a plan view when the oscillator 1 is viewed from above. FIG. 4is a side view when viewed from the bottom of FIG. 5, and is shown in astate of seeing through a mold resin 4, the container of the resonator20, and the like for the sake of convenience. In addition, FIG. 5 isshown in a state where the mold resin 4 is not present.

As illustrated in FIGS. 3 and 4, the oscillator 1 of this exemplaryembodiment has a structure (for example, a Quad Flat Non lead package(QFN) package structure) in which the integrated circuit element 10 andthe resonator 20 are sealed by the mold resin 4, and is formed into alow rectangular parallelepiped as a whole. Metal electrodes 2 a arerespectively provided in both end portions on the bottom side on eachside surface of the oscillator 1, and a plurality of metal electrodes 2b are provided between two electrodes 2 a at substantially equalintervals. The electrodes 2 a and 2 b are also exposed to peripheralportions of the bottom surface of the oscillator 1.

As illustrated in FIGS. 4 and 5, the integrated circuit element 10 ismounted on a metal stand 3, and the integrated circuit element 10 andthe stand 3 are firmly fixed to each other by an adhesive 41. The bottomsurface of the stand 3 is exposed to the bottom surface of theoscillator 1. The stand 3 extends to four corners of the oscillator 1,and the stand 3 and the electrodes 2 a are integrally formed. The stand3 and the electrodes 2 a are, for example, grounded.

As illustrated in FIG. 4, the resonator 20 includes a resonator element21 and a resonator element container 22 accommodating the resonatorelement 21. The resonator element container 22 includes abase 23provided with a concave portion in which the resonator element 21 isaccommodated, a lid 24 which is a metal member, and a seaming ring 25for bonding the base 23 and the lid 24 to each other. The member of thebase 23 is, for example, ceramics. The member of the lid 24 is, forexample, Kovar (an alloy including steel mixed with nickel and cobalt).

The resonator element 21 is a member having a thin plate shape, and hasmetal excitation electrodes 21 a and 21 b respectively provided on bothsurfaces thereof. The resonator element 21 is firmly fixed to a metalelectrode 27 provided in the base 23 by a conductive adhesive 28, andoscillates at a desired frequency based on the shape and mass of theresonator element 21 including the excitation electrodes 21 a and 21 b.As a material of the resonator element 21, a piezoelectric material, forexample, piezoelectric single crystals such as quartz crystal, lithiumtantalate, and lithium niobate, or piezoelectric ceramics such as leadzirconate titanate, a silicon semiconductor material, or the like can beused. In addition, as excitation means of the resonator element 21,excitation means using a piezoelectric effect may be used, orelectrostatic driving using a Coulomb force may be used.

As illustrated in FIGS. 4 and 5, the resonator 20 is mounted on theupper surface of the integrated circuit element 10, and the lid 24 ofthe resonator 20 and the integrated circuit element 10 are firmly fixedto each other by an adhesive 42. That is, the resonator 20 is mounted onthe integrated circuit element 10 so that the lid 24 faces theintegrated circuit element 10.

As illustrated in FIG. 5, four electrodes 26, that is, an electrode 26 a(an example of “a first electrode”), an electrode 26 b (an example of “asecond electrode”), an electrode 26 c (an example of “a thirdelectrode”), and an electrode 26 d (an example of “a fourth electrode”)are provided at four corners on the outer surface (the outer surface ofthe base 23) of the resonator element container 22 of the resonator 20.The electrode 26 a and the electrode 26 c are provided at two corners ona diagonal of the outer surface (the outer surface of the base 23) ofthe resonator element container 22, and the electrode 26 b and theelectrode 26 d are provided at the other two corners on a diagonal ofthe outer surface (the outer surface of the base 23) of the resonatorelement container 22. The electrodes 26 a and 26 c are electricallyconnected to the excitation electrodes 21 a and 21 b of the resonatorelement 21 by wirings not shown in the drawing and provided in the base23. In addition, the electrodes 26 b and 26 d are electrically connectedto the lid 24 by wirings not shown in the drawing and provided in thebase 23.

The electrode 26 a is bonded to a pad functioning as an XG terminalprovided on the upper surface of the integrated circuit element 10 by awire 51 made of gold or the like. The electrode 26 c extends between theelectrode 26 a and the electrode 26 b, and is bonded to a padfunctioning as an XD terminal provided on the upper surface of theintegrated circuit element 10 by another wire 51 at an extended end.Thereby, the wire 51 is successfully shortened. Meanwhile, theelectrodes 26 b and 26 d are in an electrically floating state in FIG.5, but may be grounded.

Some of the pads provided on the upper surface of the integrated circuitelement 10 are respectively bonded to the electrodes 2 b by wires 52made of gold or the like. In addition, the other pads (pads functioningas VSS terminals) provided on the upper surface of the integratedcircuit element 10 are bonded to the stand 3 by wires 53 made of gold orthe like.

In this manner, the oscillator 1 of this exemplary embodiment isconfigured such that the resonator 20 and the integrated circuit element10 are stacked, so that miniaturization is realized. Further, in theoscillator 1 of this exemplary embodiment, the wire 51 is shortened bythe electrode 26 c extending between the electrode 26 a and theelectrode 26 b, and thus it is possible to lower the wire 51. Thereby, aconcern that some of the wires 51 are exposed to the outside of the moldresin 4 is reduced in a sealing process of the resonator 20 and theintegrated circuit element 10.

Meanwhile, many types of resonators are configured such that terminalsare provided at four corners and have similar appearances in order tomeet demands for compatibility. Accordingly, in a case where differenttypes of resonators are mixed in a resonator group to be manufactured ina manufacturing process, it is difficult to distinguish between theresonators by their appearances, and a situation where distinction isfirst made in an inspection process may occur. On the other hand, in theoscillator 1 of this exemplary embodiment, demands for compatibility aremet because the four electrodes 26 a to 26 d are provided at fourcorners in the resonator 20, and it is possible to distinguish theresonator 20 from other resonators by appearance because the electrode26 c has a characteristic shape greatly different from those of othertypes of resonators.

1-3. Internal Arrangement of Integrated Circuit Element

FIG. 6 is a diagram illustrating an example of the internal arrangementof the integrated circuit element 10, and is a plan view of theintegrated circuit element 10 when the oscillator 1 is viewed from thesame direction as FIG. 5. FIG. 6 illustrates the arrangement of circuits(see FIG. 1) included in the integrated circuit element 10 and padsfunctioning as some terminals.

As illustrated in FIG. 6, the integrated circuit element 10 has arectangular shape including four sides 10 a, 10 b, 10 c, and 10 d whenviewed in a plan view.

The oscillation circuit 11 is disposed in the vicinity of the side 10 aof the integrated circuit element 10 when viewed in a plan view of theoscillator 1 (when viewed in a plan view of the integrated circuitelement 10). A pad (an example of “a first pad”) functioning as an XGterminal and electrically connected to the electrode 26 a of theresonator 20 is provided along the side 10 a (an example of “a firstside”) of the integrated circuit element 10. Similarly, a pad (anexample of “a second pad”) functioning as an XD terminal andelectrically connected to the electrode 26 b of the resonator 20 isprovided along the side 10 a of the integrated circuit element 10.Therefore, according to the oscillator 1 of this exemplary embodiment,an oscillation signal generated on the basis of a signal input from theXG terminal in the oscillation circuit 11 propagates through a shortwiring and is output from the XD terminal, and is thus unlikely to beinfluenced by noise.

The voltage regulator 13 is disposed between the oscillation circuit 11and the PLL circuit 14 when viewed in a plan view of the oscillator 1(when viewed in a plan view of the integrated circuit element 10). Inaddition, the control circuit 12 is disposed between the oscillationcircuit 11 and the PLL circuit 14 (the phase comparator 141, the chargepump 142, the low-pass filter 143, the voltage controlled oscillator144, the frequency division circuit 145, and the frequency divisioncircuit 146) or the PLL circuit 15 (the phase comparator 151, the chargepump 152, the low-pass filter 153, the voltage controlled oscillator154, the frequency division circuit 155, and the frequency divisioncircuit 156).

In addition, the PLL circuit 14 is disposed between the oscillationcircuit 11 and the output circuit 16 (the frequency division circuit 161and the output buffer 162) or the output circuit 17 (the frequencydivision circuit 171 and the output buffer 172) when viewed in a planview of the oscillator 1 (when viewed in a plan view of the integratedcircuit element 10). Similarly, the PLL circuit 15 is disposed betweenthe oscillation circuit 11 and the output circuit 18 (the frequencydivision circuit 181 and the output buffer 182) or the output circuit 19(the frequency division circuit 191 and the output buffer 192) whenviewed in a plan view of the oscillator 1 (when viewed in a plan view ofthe integrated circuit element 10).

In addition, the output circuit 16, the output circuit 17, the outputcircuit 18, and the output circuit 19 are disposed in a row toward theside 10 d facing (i.e., opposite) the side 10 b from the side 10 b inthe vicinity of the side 10 c facing (i.e., opposite) the side 10 a ofthe integrated circuit element 10 when viewed in a plan view of theoscillator 1 (when viewed in a plan view of the integrated circuitelement 10). A pad functioning as the OUT1 terminal or the OUT1Bterminal and electrically connected to the output circuit 16 is providedon a side close to the side 10 c along the side 10 b. In addition, a pad(another example of “a third pad”) functioning as the OUT2 terminal orthe OUT2B terminal and electrically connected to the output circuit 17is provided along the side 10 c (an example of “a second side”).Similarly, a pad (another example of “a third pad”) functioning as theOUT3 terminal or the OUT3B terminal and electrically connected to theoutput circuit 18 is provided along the side 10 c. In addition, a padfunctioning as the OUT4 terminal or the OUT4B terminal and electricallyconnected to the output circuit 19 is provided on a side close to theside 10 c along the side 10 d.

Here, an oscillation signal generated by the oscillation circuit 11propagates to the PLL circuits 14 and 15 and propagates to the outputcircuits 16 to 19, and a signal based on the oscillation signal isoutput from the OUT1 to OUT4 terminals and the OUT1B to OUTB terminals.Therefore, in the oscillator 1 of this exemplary embodiment, thecircuits and the pads are disposed so as to be matched to a flow of sucha signal as illustrated in FIG. 6, so that various signals flow insubstantially one direction toward the side 10 b from the side 10 a andwirings through which the various signals propagate are shortened.Accordingly, noise superimposed on each signal due to crosstalk withother signals or the like is reduced. Further, each wiring is shortened,and thus a wiring region becomes smaller as a whole, and thus the areaof the integrated circuit element 10 is reduced.

Further, in this exemplary embodiment, the inductors 32 and 33 (anexample of “a first inductor”) included in the voltage controlledoscillator 144 of the PLL circuit 14 are provided in the vicinity of theside 10 b, and the inductors 32 and 33 (an example of “a secondinductor”) included in the voltage controlled oscillator 154 of the PLLcircuit 15 are provided in the vicinity of the side 10 d. Thereby, awide region is formed between the inductors 32 and 33 included in thevoltage controlled oscillator 144 and the inductors 32 and 33 includedin the voltage controlled oscillator 154. As indicated by a dashed linein FIG. 6, the resonator 20 overlaps the region and does not overlap theinductors 32 and 33 when viewed in a plan view of the oscillator 1.Therefore, metal members included in the resonator 20, that is, the lid24 and the electrodes (excitation electrodes 21 a and 21 b) provided inthe resonator element 21 do not overlap the inductors 32 and 33.Further, as illustrated in FIG. 6, a guard ring 50 having a fixedvoltage (for example, a ground voltage (0 V)) is provided in thevicinity of the inductors 32 and 33, and metal members (the lid 24 andthe excitation electrodes 21 a and 21 b) included in the resonator 20 donot also overlap the guard ring 50.

Therefore, according to the oscillator 1 of this exemplary embodiment, amagnetic field generated due to a current flowing into the inductors 32and 33 is hardly blocked by the metal members included in the resonator20 (in particular, the lid 24 and the excitation electrodes 21 a and 21b which are planar metal members facing the integrated circuit element10), and an eddy current is hardly generated inside the metal members.As a result, the deterioration of Q values of the inductors 32 and 33 isreduced, and a concern that a function as a circuit element isdeteriorated is reduced.

On the other hand, the low-pass filters 143 and 153 are constituted by,for example, a resistor and a capacitor. Accordingly, the low-passfilters do not include an inductor, and thus deterioration in thecharacteristics thereof due to the metal members included in theresonator 20 hardly occurs. Consequently, in this exemplary embodiment,the low-pass filters 143 and 153 partially overlap the metal members(the lid 24 and the excitation electrodes 21 a and 21 b) included in theresonator 20. In this manner, in the oscillator 1 of this exemplaryembodiment, a circuit hardly influenced by the metal members included inthe resonator 20 is disposed so as to overlap the resonator 20 whenviewed in a plan view of the oscillator 1, and thus a region overlappingthe resonator 20 is also effectively used. As a result, an increase inthe size of the area of the integrated circuit element 10 is reduced,and the miniaturization of the oscillator 1 is realized. Meanwhile, theentirety of the low-pass filters 143 and 153 may overlap the metalmembers (the lid 24 and the excitation electrodes 21 a and 21 b)included in the resonator 20 when viewed in a plan view of theoscillator 1.

1-4. Operational Effects

As described above, in this exemplary embodiment, since the metalmembers (the lid 24 and the excitation electrodes 21 a and 21 b)included in the resonator 20 do not overlap the inductors 32 and 33 andthe guard ring 50 which are included in each of the PLL circuits 14 and15 when viewed in a plan view of the oscillator 1, a magnetic fieldgenerated due to a current flowing into the inductors 32 and 33 ishardly blocked by the metal members included in the resonator 20, and aneddy current is hardly generated inside the metal members. Therefore,according to the oscillator 1 of this exemplary embodiment, thedeterioration of Q values of the inductors 32 and 33 is reduced, and aconcern that a function as a circuit element is deteriorated is reduced.

In addition, according to this exemplary embodiment, the low-passfilters 143 and 153 hardly influenced by the metal members included inthe resonator 20 are disposed so as to overlap the resonator 20 whenviewed in a plan view of the oscillator 1, so that a region overlappingthe resonator 20 is also effectively used and the miniaturization of theoscillator 1 is realized.

Further, in this exemplary embodiment, an output signal of theoscillation circuit 11 propagates to the PLL circuits 14 and 15, and anoscillation signal output from the PLL circuits 14 and 15 propagates tothe output circuits 16 to 19. That is, a signal input to the integratedcircuit element 10 from the electrode 26 a of the resonator 20 through apad functioning as an XG terminal propagates toward the side 10 c fromthe side 10 a, and is output through pads functioning as the OUT1 toOUT4 terminals or the OUT1B to OUT4B terminals. In this exemplaryembodiment, the PLL circuits 14 and 15 are disposed between theoscillation circuit 11 and the output circuit 16 to 17 so as to bematched to flows of such various signals in the integrated circuitelement 10, and thus wirings through which the various signals propagateare shortened. Therefore, according to the oscillator 1 of thisexemplary embodiment, parasitic capacitance of each wiring is reduced,and noise superimposed on each signal due to crosstalk with othersignals or the like is reduced. Further, since each wiring becomesshort, a wiring region is reduced as a whole, and the area of theintegrated circuit element 10 is reduced.

In addition, according to this exemplary embodiment, it is possible toconnect the electrodes 26 a and 26 c provided on the outer surface ofthe base 23 of the resonator 20 and the pad functioning as the XGterminal provided in the integrated circuit element 10 and the padfunctioning as the XD terminal through wire bonding, and thus it is easyto mount the oscillator 1. In addition, according to the oscillator 1 ofthis exemplary embodiment, a bonding wire can be lowered by theelectrode 26 c extending between the electrode 26 a and the electrode 26b, and thus a concern that a portion of the bonding wire is exposed tothe outside of the mold resin 4 is reduced in a sealing process of theresonator 20 and the integrated circuit element 10. Further, in theoscillator 1 of this exemplary embodiment, since four electrodes 26 a to26 d are provided at four corners in the resonator 20, it is possible toshare a manufacturing device and an inspection device, and demands forcompatibility are met. In addition, since the electrode 26 c extendsbetween the electrode 26 a and the electrode 26 b, it is possible todistinguish the resonator 20 from other resonators by appearance.

1-5. Modification Example

For example, in the oscillator 1 of the above-described exemplaryembodiment, the integrated circuit element 10 includes two PLL circuitseach including an inductor. However, the integrated circuit element mayinclude one PLL circuit or three or more PLL circuits, and the inductorsmay be disposed so as not to overlap the metal members included in theresonator 20 when viewed in a plan view of the oscillator 1.

In addition, for example, in the oscillator 1 of the above-describedexemplary embodiment, the inductors 32 and 33 constitute a portion ofthe voltage controlled oscillators 144 and 154 (LC oscillator) in thePLL circuits 14 and 15 of the integrated circuit element 10. However,the inductors may constitute portions of an LC filter and an LR filterin the PLL circuit, and the inductors may be disposed so as not tooverlap the metal members included in the resonator 20 when viewed in aplan view of the oscillator 1.

Further, for example, in the oscillator 1 of the above-describedexemplary embodiment, the resonator 20 is configured such that the lid24 is a metal member, but the resonator 20 may not include the lid 24which is a metal member. For example, the oscillator 1 may be anoscillator having a structure in which a resonator element isaccommodated by a base made of silicon and a lid (cap) made of glass, anoscillator having a structure in which a resonator element isaccommodated by a base and a lid which are made of quartz crystal, orthe like. Also in the oscillator 1 having these structures, theinductors included in the integrated circuit element 10 are disposed,for example, so as not to overlap the electrodes provided in theresonator element 21, and thus the deterioration of Q values of theinductors is reduced.

Further, for example, in the oscillator 1 of the above-describedexemplary embodiment, the metal members (the lid 24 and the excitationelectrodes 21 a and 21 b of the resonator element 21) included in theresonator 20 do not overlap the inductors. However, a lid, electrodes ofa resonator element, and the like which are constituted by a conductivemember other than a metal may be configured not to overlap theinductors. In a case of a conductive member, an eddy current may begenerated, but an eddy current is hardly generated inside the conductivemember by preventing overlapping with the inductors, thereby reducingthe deterioration of Q values of the inductors.

Meanwhile, in the oscillator 1 of the above-described exemplaryembodiment, both the inductors 32 and 33 included in the integratedcircuit element 10 are disposed so as not to overlap the metal membersincluded in the resonator 20, but not all of the inductors included inthe integrated circuit element 10 are necessarily disposed so as not tooverlap the metal members. For example, in a case where the integratedcircuit element 10 includes an LC oscillator and a filter, a higher Qvalue is required for an inductor included in the LC oscillator. Thus, aconfiguration in which the inductor is disposed so as not to overlap themetal members and an inductor included in the filter is disposed so asto overlap the metal members from the viewpoint of miniaturization maybe adopted.

2. Electronic Apparatus

FIG. 7 is a functional block diagram illustrating an example of aconfiguration of an electronic apparatus of this exemplary embodiment.In addition, FIG. 8 is a diagram illustrating an example of theappearance of a smartphone which is an example of the electronicapparatus of this exemplary embodiment.

An electronic apparatus 300 of this exemplary embodiment is configuredto include an oscillator 310, a Central Processing Unit (CPU) 320, anoperation unit 330, a Read Only Memory (ROM) 340, a Random Access Memory(RAM) 350, a communication unit 360, and a display unit 370. Meanwhile,the electronic apparatus of this exemplary embodiment may be configuredsuch that some of the components (units) illustrated in FIG. 7 areomitted or changed, or other components are added thereto.

The oscillator 310 includes an integrated circuit element 312 and aresonator 313. The integrated circuit element 312 oscillates theresonator 313 to generate an oscillation signal. The oscillation signalis output from an external terminal of the oscillator 310 to the CPU320. The integrated circuit element 312 includes a PLL circuit not shownin the drawing, converts the frequency of the oscillation signal outputfrom the resonator 313 by the PLL circuit, and outputs an oscillationsignal having a frequency based on setting from the CPU 320.

The CPU 320 (processing unit) is a processing unit that performs variouscalculation processes and control processes by using the oscillationsignal input from the oscillator 310 as a clock signal in accordancewith programs stored in the ROM 340 and the like. Specifically, the CPU320 performs various processes according to an operation signal from theoperation unit 330, a process of controlling the communication unit 360in order to perform data communication with an external device, aprocess of transmitting display signals for displaying various pieces ofinformation on the display unit 370, and the like.

The operation unit 330 is an input device constituted by operation keys,button switches, and the like, and outputs an operation signal accordingto a user's operation to the CPU 320.

The ROM 340 is a storage unit that stores programs, data, and the likefor performing various calculation processes and control processes bythe CPU 320.

The RAM 350 is a storage unit which is used as a work area of the CPU320, and temporarily stores programs and data read out from the ROM 340,data input from the operation unit 330, results of computation executedby the CPU 320 in accordance with various programs, and the like.

The communication unit 360 performs various control processes forestablishing data communication between the CPU 320 and an externaldevice.

The display unit 370 is a display device constituted by a Liquid CrystalDisplay (LCD) and the like, and displays various pieces of informationon the basis of display signals input from the CPU 320. A touch panelfunctioning as the operation unit 330 may be provided in the displayunit 370.

By applying, for example, the oscillator 1 of the above-describedexemplary embodiment as the oscillator 310, it is possible to reduce aconcern that a function as a circuit element is deteriorated due to thedeterioration of a Q value of the inductor built into the integratedcircuit element 312, and thus it is possible to implement the electronicapparatus with high reliability.

Various electronic apparatuses are conceived as the electronic apparatus300, and may be, for example, a personal computer (for example, a mobiletype personal computer, a laptop type personal computer, and a tablettype personal computer), a mobile terminal such as a smartphone or amobile phone, a digital camera, an ink jet type ejection device (forexample, an ink jet printer), a storage area network apparatus such as arouter or a switch, a local area network apparatus, a mobile terminalbase station apparatus, a television, a video camera, a video recorder,a car navigation device, a real-time clock device, a pager, anelectronic organizer (including a communication function), an electronicdictionary, an electronic calculator, an electronic gaming machine, agaming controller, a word processor, a workstation, a videophone, asecurity television monitor, electronic binoculars, a point of sale(POS) terminal, a medical apparatus (for example, an electronicthermometer, a sphygmomanometer, a blood glucose monitoring system, anelectrocardiographic apparatus, an ultrasonic diagnostic apparatus, oran electronic endoscope), a fish-finder, various measurementapparatuses, meters and gauges (for example, meters and gauges ofvehicles, aircrafts, and ships), a flight simulator, a head mounteddisplay, a motion tracer, a motion tracker, a motion controller, apedestrian dead reckoning (PDR) apparatus, and the like.

As an example of the electronic apparatus 300 of this exemplaryembodiment, a transmission device functioning as a terminal base stationapparatus communicating with, for example, a terminal in a wired orwireless manner, or the like by using the above-described oscillator 310as a reference signal source is used. By applying, for example, theoscillator 1 of the above-described exemplary embodiment as theoscillator 310, and thus it is also possible to implement the electronicapparatus 300 which is usable in, for example, a communication basestation and the like and is desired to have high frequency accuracy,high performance, and high reliability at lower costs than in therelated art.

In addition, another example of the electronic apparatus 300 of thisexemplary embodiment may be a communication device including a frequencycontrol unit in which the communication unit 360 receives an externalclock signal and the CPU 320 (processing unit) controls the frequency ofthe oscillator 310 on the basis of the external clock signal and anoutput signal (internal clock signal) of the oscillator 310. Thecommunication device may be a communication apparatus which is used in abackbone network apparatus such as a stratum 3, or a femtocell.

3. Vehicle

FIG. 9 is a diagram (top view) illustrating an example of a vehicle ofthis exemplary embodiment. A vehicle 400 illustrated in FIG. 9 isconfigured to include an oscillator 410, controllers 420, 430, and 440,such as an engine system, a brake system, and a keyless entry system,which perform various control processes, a battery 450, and a bufferbattery 460. Meanwhile, the vehicle of this exemplary embodiment may beconfigured such that some of the components (units) illustrated in FIG.9 are omitted or changed, or other components are added thereto.

The oscillator 410 includes an integrated circuit element and aresonator not shown in the drawing, and the integrated circuit elementoscillates the resonator to generate an oscillation signal. Theoscillation signal is output to the CPU 320 from an external terminal ofthe oscillator 410. The integrated circuit element includes a PLLcircuit not shown in the drawing, converts the frequency of theoscillation signal output from the resonator by the PLL circuit, andoutputs an oscillation signal having a frequency based on setting. Theoscillation signal is output to the controllers 420, 430, and 440 fromthe external terminal of the oscillator 410, and is used as, forexample, a clock signal.

The battery 450 supplies power to the oscillator 410 and the controllers420, 430, and 440. The buffer battery 460 supplies power to theoscillator 410 and the controllers 420, 430, and 440 when an outputvoltage of the battery 450 falls below a threshold value.

By applying, for example, the oscillator 1 of the above-describedexemplary embodiment as the oscillator 410, it is possible to reduce aconcern that a function as a circuit element is deteriorated due to thedeterioration of a Q value of an inductor built into the integratedcircuit element of the oscillator 410, and thus it is possible toimplement the vehicle with high reliability.

Various vehicles are conceived as the vehicle 400, and may be, forexample, an automobile (also including an electric car), an aircraftsuch as a jet plane or a helicopter, a ship, a rocket, an artificialsatellite, and the like.

The invention is not limited to this exemplary embodiment, variousmodifications can be made without departing from the scope of theinvention.

The above-described exemplary embodiment and modification example arejust examples, and the invention is not limited thereto. For example,the exemplary embodiment and the modification example may also beappropriately combined with each other.

The invention includes substantially the same configurations (forexample, configurations having the same functions, methods and results,or configurations having the same objects and effects) as theconfigurations described in the exemplary embodiment. In addition, theinvention includes a configuration obtained by replacing non-essentialportions in the configurations described in the exemplary embodiment. Inaddition, the invention includes a configuration that exhibits the sameoperational effects as those of the configurations described in theexemplary embodiment or a configuration capable of achieving the sameobjects. In addition, the invention includes a configuration obtained byadding the configurations described in the exemplary embodiment to knowntechniques.

What is claimed is:
 1. An oscillator comprising: a resonator whichincludes a resonator element and a resonator element containeraccommodating the resonator element; and an integrated circuit elementwhich includes an inductor, wherein the resonator and the integratedcircuit element are stacked on each other, the resonator includes aconductive member, the conductive member does not overlap the inductorwhen viewed in a plan view, the integrated circuit element furtherincludes a guard ring provided in a vicinity of the inductor, and theconductive member does not overlap the guard ring when viewed in theplan view.
 2. The oscillator according to claim 1, wherein theintegrated circuit element includes a PLL circuit including the inductorand a filter, and the filter overlaps the conductive member when viewedin the plan view.
 3. A vehicle comprising the oscillator according toclaim
 2. 4. An electronic apparatus comprising the oscillator accordingto claim
 2. 5. The oscillator according to claim 2, wherein theintegrated circuit element includes an oscillation circuit which isconnected to the resonator, and an output circuit which outputs a signalbased on an oscillation signal output from the PLL circuit, theoscillation signal is phase-synchronized with an output signal of theoscillation circuit, and the PLL circuit is disposed between theoscillation circuit and the output circuit when viewed in the plan view.6. An electronic apparatus comprising the oscillator according to claim5.
 7. A vehicle comprising the oscillator according to claim
 5. 8. Theoscillator according to claim 5, wherein the integrated circuit elementincludes a first pad which is electrically connected to one end of theresonator, a second pad which is electrically connected to the other endof the resonator, and a third pad which is electrically connected to theoutput circuit, the first pad and the second pad are provided along afirst side of the integrated circuit element, and the third pad isprovided along a second side opposite the first side of the integratedcircuit element.
 9. A vehicle comprising the oscillator according toclaim
 8. 10. An electronic apparatus comprising the oscillator accordingto claim
 8. 11. The oscillator according to claim 1, wherein theresonator element container includes a base which is provided with aconcave portion accommodating the resonator element, and a lid which isthe conductive member, and the resonator is mounted on the integratedcircuit element so that the lid faces the integrated circuit element.12. An electronic apparatus comprising the oscillator according to claim11.
 13. The oscillator according to claim 1, wherein the conductivemember is an electrode provided in the resonator element.
 14. Theoscillator according to claim 1, wherein a first electrode, a secondelectrode, a third electrode, and a fourth electrode are provided atfour corners on an outer surface of the resonator element container, thefirst electrode and the third electrode are provided at two corners on adiagonal of the outer surface, the second electrode and the fourthelectrode are provided at the other two corners on a diagonal of theouter surface, and the third electrode extends between the firstelectrode and the second electrode.
 15. An electronic apparatuscomprising the oscillator according to claim
 1. 16. A vehicle comprisingthe oscillator according to claim
 1. 17. The oscillator according toclaim 1, wherein the conductive member is a metal member.
 18. Anoscillator comprising: a resonator which includes a resonator elementand a resonator element container accommodating the resonator element;and an integrated circuit element, wherein the resonator and theintegrated circuit element are stacked on each other, the integratedcircuit element includes an oscillation circuit which is connected tothe resonator, a first PLL circuit which includes a first inductor, anda second PLL circuit which includes a second inductor, a firstoscillation signal output from the first PLL circuit and a secondoscillation signal output from the second PLL circuit arephase-synchronized with an output signal of the oscillation circuit, theresonator includes a conductive member, and the conductive member doesnot overlap the first inductor and the second inductor when viewed in aplan view.
 19. The oscillator according to claim 18, wherein theconductive member is a metal member.
 20. An oscillator comprising: aresonator which includes a conductive member; and an integrated circuitelement which includes an inductor, wherein the resonator and theintegrated circuit element are stacked on each other in a stackingdirection, the conductive member does not overlap the inductor whenviewed along the stacking direction, the integrated circuit elementfurther includes a guard ring provided in a vicinity of the inductor,and the conductive member does not overlap the guard ring when viewedalong the stacking direction.